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Dimension

10680*1600*2150mm

Weight

4630kg

Rated power

20kw

Electric power

AC380v/50hz

Air pressure

0.5~0.6mpa

Type

Solar monocrystalline /polysilicon wafers cut by diamond thread

Dimension

157*157~230*230mm

Thickness

80-240um

Defects

Warping, bending, edge chipping,
surface chipping, chamfer chipping,
soiling, holes, hidden cracks

Measurement item

Thickness, Wire Marks, Resistivity, TTV,
Roughness, Dimensions, PN Type

CT（182*182mm）= 0.25s/pcs，WPH≥16000

CT（210*210mm）= 0.3 s/pcs，WPH≥14000

Function and Performance Advantages
Currently the industry's highest performance in terms of wafers per hour (WPH) is more than 16,000, which is much higher than the industry average of 10,000~12,000. Measurement accuracy reaches 0.8um, fragmentation rate is stable below 0.05%. Leakage rate < 0.1%. Overkill rate < 0.05%.
Electromechanical Advantages
Feeding: two sets of cache mechanism seamlessly connects the feeding; compatible with multi-size flower baskets;Unloading: Bernoulli suspension type unloading device is adopted to ensure a very low fragmentation rate; parallel multiple independent unloading devices; seamless switching of unloading boxes.
Inspection Advantages
Multi-station inspection of chipping and surface defects around the wafer, using a deep learning model that recognises the silicon material and completes the inspection with high accuracy.
Measurement Advantages
Dual top and bottom line scanning cameras accurately identify thickness, flatness and line marks. Rejecting hidden cracks and fragments in advance of the inspection stage reduces the burden of subsequent downstream sorting.